A month ago, Huawei created buzz in the smartphone industry when the company launched its powerful mobile process Kirin 980 SoC. It is the SoC built on 7-nm manufacturing process. Now, the world’s top mobile chipmaker company Qualcomm is set to launch its new SoC named Snapdragon 8150.
Currently, Qualcomm is offering Snapdragon 845 which was launched a year ago. As the Huawei and Samsung have already launched their more powerful processors, the chipmaker giant is set to unveil an even more powerful SoC on 4 December at the Qualcomm Annual Tech Summit. As per reports, the upcoming processor will have “tri-cluster technology” which was first used by the rival company MediaTek. Back in 2015, MediaTek had launched the first mobile processor with 10-cores using tri-cluster technology. This technology allows arranging the processor core in three clusters instead of two which results in more efficient performance and a better battery life. Huawei has also launched its latest processor with three cluster core arrangement.
This information comes from an image shared on Twitter by Ice Universe (@UniverseIce) that reveals Snapdragon 8150 having 8-cores arranged in a 1+3+4 tri-cluster. As per the image, the Snapdragon 8150 will have 1 Kryo Gold Prime core with a 512KB L2 cache clocked at 2.842GHz, 3 Kryo Gold cores with a 256KB L2 cache per core with a maximum frequency of 2.419GHz, and 4 low-power Kryo Silver cores with a 128KB L2 cache per core clocked at 1.786GHz.
Recently, Snapdragon 8150 was in news because of its benchmark score spotted on AnTuTu. The chipset has scored 362,292 points on AnTuTu making it the first chipset running on Android platform to have crossed the benchmark of 360,000 points. Huawei’s Kirin 980 chipset managed to score an average of 311,840 points.